[Intel-wired-lan] [PATCH iwl-next v1 3/3] ice: add support for 3k signing DDP sections for E825C

[Pucha, HimasekharX Reddy]

> -----Original Message-----
> From: Intel-wired-lan <intel-wired-lan-bounces at osuosl.org> On Behalf Of Grzegorz Nitka
> Sent: Thursday, December 7, 2023 12:59 AM
> To: intel-wired-lan at lists.osuosl.org
> Cc: netdev at vger.kernel.org
> Subject: [Intel-wired-lan] [PATCH iwl-next v1 3/3] ice: add support for 3k signing DDP sections for E825C
>
> E825C devices shall support the new signing type of RSA 3K for new DDP
> section (SEGMENT_SIGN_TYPE_RSA3K_E825 (5) - already in the code).
> The driver is responsible to verify the presence of correct signing type.
> Add 3k signinig support for E825C devices based on mac_type:
> ICE_MAC_GENERIC_3K_E825;
>
> Signed-off-by: Grzegorz Nitka <grzegorz.nitka at intel.com>
> ---
>  drivers/net/ethernet/intel/ice/ice_common.c | 6 ++++++
>  drivers/net/ethernet/intel/ice/ice_ddp.c    | 4 ++++
>  2 files changed, 10 insertions(+)
>

Tested-by: Pucha Himasekhar Reddy <himasekharx.reddy.pucha at intel.com> (A Contingent worker at Intel)